Imran Hajimusa

HomeGrid Forum, Vice President & Head of Regional Center North America, Broadband Access
Infineon Technologies North America

Imran has more than 15 years of multi-national experience in engineering and leading the business. Living and working in three different continents has enriched his global experience that is an asset to lead global business in fast moving market dynamics. Before joining Siemens Microelectronics, he worked as a network consultant. His first position at Siemens was as an ASIC designer in Singapore. Later, he moved to Munich, where he held various positions including firmware development manager, Chip Architect, Program Manager and Director of R&D at Infineon Technologies. He also served for three years as elected chair of the technical group under the umbrella of the European Association of Consumer Electronics Manufacturers. After returning to the U.S.A. in 2001, he led Infineon's worldwide DSL CO segment from 1% market share to 22%. He is currently serving as Vice President of Broadband Access leading the North American Operations. He sits on the Board of HomeGrid Forum as a director and Vice President. He holds several patents, and earned his BSEE and an MSCE from the University of Southern California.